Semiconductor Flame Fused Quartz Ingot

I. Application

Semiconductor flame fused ingot is manufactured with high purity quartz sand by oxy-hydrogen flame fusion process. It is utilized as basic high quality quartz material in semiconductor applications.

II. Product Features

Semiconductor flame fused ingot features superior purity and can meet different optical requirements.

III. Product Type

WQPQ870 | WQPQ871E

IV. Typical Size

DiameterHeight
100-800mm100-2000mm

V. Physical and Chemical Properties

i. Physical Properties

ItemIndex Value
Density(g/cm32.2
Heat Conductivity(w/m·k,1000℃)2.28
Coefficient of Thermal Expansion(℃-1,1000℃)5.5×10-7
Softening Point(℃)1670
Annealing Point(℃)1210
Strain Point(℃)1110

ii. Trace Elements

CodeCriteriaAlCaCrCuFeKLiMgMnNaTiZr
PQ870Typical0.090.02<0.01<0.010.020.02<0.010.02<0.010.020.05<0.01
 PQ871ETypical130.5<0.05<0.050.10.10.30.050.050.11.31
Maximum1910.10.10.5110.20.2122

iii. OH Content

OH = 200PPM

iv. Coefficient of Thermal Expansion and Viscosity

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