I. Application
Semiconductor flame fused ingot is manufactured with high purity quartz sand by oxy-hydrogen flame fusion process. It is utilized as basic high quality quartz material in semiconductor applications.
II. Product Features
Semiconductor flame fused ingot features superior purity and can meet different optical requirements.
III. Product Type
WQPQ870 | WQPQ871E
IV. Typical Size
Diameter | Height |
100-800mm | 100-2000mm |
V. Physical and Chemical Properties
i. Physical Properties
Item | Index Value |
Density(g/cm3) | 2.2 |
Heat Conductivity(w/m·k,1000℃) | 2.28 |
Coefficient of Thermal Expansion(℃-1,1000℃) | 5.5×10-7 |
Softening Point(℃) | 1670 |
Annealing Point(℃) | 1210 |
Strain Point(℃) | 1110 |
ii. Trace Elements
Code | Criteria | Al | Ca | Cr | Cu | Fe | K | Li | Mg | Mn | Na | Ti | Zr |
PQ870 | Typical | 0.09 | 0.02 | <0.01 | <0.01 | 0.02 | 0.02 | <0.01 | 0.02 | <0.01 | 0.02 | 0.05 | <0.01 |
PQ871E | Typical | 13 | 0.5 | <0.05 | <0.05 | 0.1 | 0.1 | 0.3 | 0.05 | 0.05 | 0.1 | 1.3 | 1 |
Maximum | 19 | 1 | 0.1 | 0.1 | 0.5 | 1 | 1 | 0.2 | 0.2 | 1 | 2 | 2 |
iii. OH Content
OH = 200PPM