I. Application
Semiconductor flame fused ingot is manufactured with high purity quartz sand by oxy-hydrogen flame fusion process. It is utilized as basic high quality quartz material in semiconductor applications.
II. Product Features
Semiconductor flame fused ingot features superior purity and can meet different optical requirements.
III. Product Type
WQPQ870 | WQPQ871E
IV. Typical Size
| Diameter | Height |
| 100-800mm | 100-2000mm |
V. Physical and Chemical Properties
i. Physical Properties
| Item | Index Value |
| Density（g/cm3） | 2.2 |
| Heat Conductivity（w/m·k，1000℃） | 2.28 |
| Coefficient of Thermal Expansion（℃-1，1000℃） | 5.5×10-7 |
| Softening Point（℃） | 1670 |
| Annealing Point（℃） | 1210 |
| Strain Point（℃） | 1110 |
ii. Trace Elements
| Code | Criteria | Al | Ca | Cr | Cu | Fe | K | Li | Mg | Mn | Na | Ti | Zr |
| PQ870 | Typical | 0.09 | 0.02 | <0.01 | <0.01 | 0.02 | 0.02 | <0.01 | 0.02 | <0.01 | 0.02 | 0.05 | <0.01 |
| PQ871E | Typical | 13 | 0.5 | <0.05 | <0.05 | 0.1 | 0.1 | 0.3 | 0.05 | 0.05 | 0.1 | 1.3 | 1 |
| Maximum | 19 | 1 | 0.1 | 0.1 | 0.5 | 1 | 1 | 0.2 | 0.2 | 1 | 2 | 2 |
iii. OH Content
OH = 200PPM
iv. Coefficient of Thermal Expansion and Viscosity
